Renliang Yuan

Engineer
Univ of illinois, Illinois, United States

Renliang Yuan is currently a failure analysis engineer at Intel with expertise in transmission electron microscopy. He obtained Ph.D. degree in Materials Science from University of Illinois at Urbana-Champaign, and Bachelor degree in Physics from Peking University in China.

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Presentation(s):

• Extending 4D-STEM to Defect and Short-Range Ordering Analysis: Principles, Methodology and Applications

  Monday, July 24, 2023
  1:30 PM – 2:00 PM US CST

• High Efficiency Compression Algorithm for Four-Dimensional Scanning Transmission Electron Microscopy

  Thursday, July 27, 2023
  9:00 AM – 9:15 AM US CST