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ViewAttendees 3

Featured Symposium

Analytical Sciences Symposia

High-Speed 4D-STEM using Electrostatic Subframing

Wednesday, July 26, 2023
11:15 AM – 11:30 AM US CST
Location: 200B

    Presenting Author(s)

  • BR

    Bryan W. Reed

    Integrated Dynamic Electron Solutions, Inc., United States

    • Co-Author(s)

  • RB

    Ruth S. Bloom

    Integrated Dynamic Electron Solutions, Inc., United States

  • KY

    Kazuki Yagi (he/him/his)

    Application Engineer
    Integrated Dynamic Electron Solutions, Inc.
    Plesanton, California, United States

  • DM

    Daniel J. Masiel

    Integrated Dynamic Electron Solutions, Inc., United States